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Accurate Indent and Cleaving System
The PELCO® LatticeAx® 225 Precision Indent and Cleaving System (formerly from LatticeGear™) builds on the patented PELCO® LatticeAx® 120 base system with the addition of high magnification imaging, enabling increased precision of indenter positioning. This results in samples cleaved with increased accuracy. The PELCO® LatticeAx® 225 can deliver 20μm positional accuracy with high quality cleaved surfaces in approximately 5 minutes for a trained operator. The imaging package includes a focusing mount, a digital microscope with polarizer and real-time image acquisition and display software. Through realtime imaging, the indent is placed accurately with respect to the target making cleaving the sample target simple and fast for all trained users. The PELCO® LatticeAx® 225 accepts samples of multiple material types through a wide range of surface area sizes and thicknesses.
Using simple mechanics, the PELCO® Small Sample Cleaver™ (formerly from LatticeGear™) uses a novel sample holder and a cleaving platform to safely cleave samples into chips as small as 2 x 2mm. The novel sample holder allows samples from 4-10mm to be held during indenting and cleaving. No more handling samples directly with fingers – gloved hands are ok. The holder has no screws, springs or pins. Accepts samples from 3-15mm in width and 200-900µm in thickness.
The Large Sample Platform is a PELCO® LatticeAx® option that adds support for wafers and samples up to 300mm. It consists of a support system and an indenter extension. The five fingers support large samples while the extender puts the fine-positioning knob for the indenter within easy reach. The Large Sample Platform fits on all models of PELCO® LatticeAx® systems and is easy to install with a single set screw.