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The Cleaving Kit contains everything required for hand scribing and cleaving most samples. The kit can be purchased with or without the Large Cutting Mat (A3, 18 x 12" nominal size).
The Cleaving Station contains a comprehensive set of tools for scribing and cleaving both large and small samples. The kit can be purchased with or without the Large Cutting Mat (A3, 18 x 12" nominal size).
The Small Sample Cleaving Kit contains tools for manually scribing and cleaving small samples down to 2-3mm.
Handheld tools for cutting and cleaving glass, silicon, and hard materials. Carbide wheels produce fewer particles when scribing, when compared to diamond pointed scribes. Both large and small CleanBreak™ pliers are included for handling larger and thicker samples. The cutters included are: Standard cutter for general purposes cutting of glass, silicon, and other crystalline materials. Also suitable for thin glass 0.3-1.5 mm and hard glass 0.3-6mm thick; Laser cutter, allowing higher surface penetration and non-slip start. It is used for glass 0.1-2 mm think, hard glass 0.3-2 mm thick, and quartz, silicon, and III-V substrates; Cutter for ultra-thin glass 0.03-2mm and hard glass 0.3-2mm. It also excels at cutting thin quartz and III-V substrates.
A diamond scriber set ideal for fine marks and scribing a wafer surface. Three diamond scribers are included.
The LatticeScriber™ is the optimal tool for scribing silicon, III-V semiconductors, and similar materials. The scribe tip is an 8-point diamond, allowing flexibility to meet demanding scribing requirements and long tool life.
General purpose diamond wheel cutter. Good for hard glass 0.3-3mm. This cutter is best for harder materials such as hard glass, LCD, sapphire, quartz glass and ceramic. Wheel cutters produce a cleaner scribe line than point scribes and minimize the number of particles generated. Plastic handle is 5" long.
In this diamond wheel cutter, Laser refers to the profile applied to the wheel. This allows for a non-slip start and deeper scoring. This cutter excels at cutting thin glass (as fine as 0.03mm), LCD, half-tempered glass, sapphire, quartz glass, ceramic, glass tubes and standard silicon substrates. Wheel cutters produce a cleaner scribe line than point scribes and minimize the number of particles generated. Plastic handle is 5" long.
General purpose tungsten carbide cutter for glass, silicon, and other crystalline materials. Suitable for glass 0.3-1.5mm and hard glass 0.3-6mm. Wheel cutters produce a cleaner scribe line than pointed scribe, minimizing the number of particles produced. Plastic handle is 5" long.
In this carbide wheel cutter, Laser refers to the profile applied to the wheel. This allows for a non-slip start and deeper scoring. Good for glass 0.1-2mm and hard glass 0.3-2mm. This cutter excels at cutting thin glass, hard glass, quartz, silicon and III-V semiconductors. Wheel cutters produce a cleaner scribe line than point scribes and minimize the number of particles generated. Plastic handle is 5" long.
Laser refers to the profile applied to the wheel. This allows for a non-slip start and deeper scoring. For this cutter, a sharper tip angle allows for a narrower scribe line. Good for very thin glass 0.03mm up to 2mm and hard glass 0.3-2mm. This cutter excels at cutting ultra-thin glass, as well as hard glass, quartz, silicon and III-V semiconductors. Wheel cutters produce a cleaner scribe line than point scribes and minimize the number of particles generated. Plastic handle is 5" long.
High quality cleaving pliers, supplied with plastic 3-point cleaving jaws for crystalline substrates, and flat metal jaws for glass and ceramics. These 6" long pliers have a 0.75" jaw opening, suitable for crystals and glass up to 2mm thick. Supplied with a spare set of running jaws.
High quality cleaving pliers, supplied with plastic 3-point cleaving jaws for crystalline substrates, and flat metal jaws for glass and ceramics. These 8" long pliers have a 0.9" jaw opening, suitable for thick substrates and hard materials such as sapphire. Supplied with a spare set of running jaws.
Soft-jaw sample cleaving pliers for small samples are ideal for cleaving scribed samples down to 2-3mm in size. The nylon jaws prevent marring of the sample during cleaving. Replacement tips available.
Using a flat surface for the wire, center the previously scribed line over the wire and cleave the sample by pressing down with gentle finger pressure on the sample material on either side of the scribed line over the wire. This is an alternative to using cleaving pliers for initiating a cleave with a 3-point bending moment. The length of the wire is 2.5". The bend in the wire keeps it from rolling on a flat surface
8" and 16cm clear ruler and square. A handy layout tool for scribing.
Protective gloves to wear when cleaving silicon, glass, or other substrates or for handling razor blades and diamond knives. These gloves can be used alone but are thin enough to be worn as a liner beneath latex or nitrile gloves and still give reasonable touch sensitivity.
These 7 gauge gloves are made of Kevlar® and have ANSI cut A3, abrasion 2 and heat 3 ratings. They are intended for light/medium cut hazards.