Your Secure Session, is about to expire in seconds.
For more information, please read our Privacy Policy.
The Cleaving Kit contains everything required for hand scribing and cleaving most samples. The kit can be purchased with or without the Large Cutting Mat (A3, 18 x 12" nominal size).
The Cleaving Station contains a comprehensive set of tools for scribing and cleaving both large and small samples. The kit can be purchased with or without the Large Cutting Mat (A3, 18 x 12" nominal size).
The Small Sample Cleaving Kit contains tools for manually scribing and cleaving small samples down to 2-3mm.
Handheld tools for cutting and cleaving glass, silicon, and hard materials. Carbide wheels produce fewer particles when scribing, when compared to diamond pointed scribes. Both large and small CleanBreak™ pliers are included for handling larger and thicker samples. The cutters included are: Standard cutter for general purposes cutting of glass, silicon, and other crystalline materials. Also suitable for thin glass 0.3-1.5 mm and hard glass 0.3-6mm thick; Laser cutter, allowing higher surface penetration and non-slip start. It is used for glass 0.1-2 mm think, hard glass 0.3-2 mm thick, and quartz, silicon, and III-V substrates; Cutter for ultra-thin glass 0.03-2mm and hard glass 0.3-2mm. It also excels at cutting thin quartz and III-V substrates.
A diamond scriber set ideal for fine marks and scribing a wafer surface. Three diamond scribers are included.
The LatticeScriber™ is the optimal tool for scribing silicon, III-V semiconductors, and similar materials. The scribe tip is an 8-point diamond, allowing flexibility to meet demanding scribing requirements and long tool life.
General purpose tungsten carbide cutter for glass, silicon, and other crystalline materials. Suitable for glass 0.3-1.5mm and hard glass 0.3-6mm. Wheel cutters produce a cleaner scribe line than pointed scribe, minimizing the number of particles produced. Plastic handle is 5" long.
In this carbide wheel cutter, Laser refers to the profile applied to the wheel. This allows for a non-slip start and deeper scoring. Good for glass 0.1-2mm and hard glass 0.3-2mm. This cutter excels at cutting thin glass, hard glass, quartz, silicon and III-V semiconductors. Wheel cutters produce a cleaner scribe line than point scribes and minimize the number of particles generated. Plastic handle is 5" long.
Laser refers to the profile applied to the wheel. This allows for a non-slip start and deeper scoring. For this cutter, a sharper tip angle allows for a narrower scribe line. Good for very thin glass 0.03mm up to 2mm and hard glass 0.3-2mm. This cutter excels at cutting ultra-thin glass, as well as hard glass, quartz, silicon and III-V semiconductors. Wheel cutters produce a cleaner scribe line than point scribes and minimize the number of particles generated. Plastic handle is 5" long.
High quality cleaving pliers, supplied with plastic 3-point cleaving jaws for crystalline substrates, and flat metal jaws for glass and ceramics. These 6" long pliers have a 0.75" jaw opening, suitable for crystals and glass up to 2mm thick. Supplied with a spare set of running jaws.
High quality cleaving pliers, supplied with plastic 3-point cleaving jaws for crystalline substrates, and flat metal jaws for glass and ceramics. These 8" long pliers have a 0.9" jaw opening, suitable for thick substrates and hard materials such as sapphire. Supplied with a spare set of running jaws.
Soft-jaw sample cleaving pliers for small samples are ideal for cleaving scribed samples down to 2-3mm in size. The nylon jaws prevent marring of the sample during cleaving. Replacement tips available.
8" and 16cm clear ruler and square. A handy layout tool for scribing.