The  PELCO® FlipScribe® (formerly from LatticeGear™) takes scribing to a new performance level, making clean, straight scribe lines  on the back side to allow the user to accurately cleave front side targets,  bonded wafers, glass, sapphire and other substrates. It integrates a robust  diamond scribe into a sample platform with a fence guide design. The time required  to align and scribe is about 1 minute. It allows users to accurately position  the scribe mark relative to features on the front side, visualized either by  eye or with a user-supplied high magnification microscope. The PELCO®FlipScribe® also offers a quick method for cleanly downsizing large area samples, by the  use of a "scribe stop" which allows the operator to define the length  of the scribe. The PELCO® FlipScribe®  is a compact, stable, accurate, fast and low  cost scribing and cleaving solution suitable for any lab; no utilities are  required for its operation. 
		      Features
            
              - Enables accurate cleaving through front side targets with a scribe made on the back side of the substrate 
 
              - Avoids damaging  the front side of the sample 
 
              - Achieves an  accuracy of ±200μm 
 
              - Maintains a flexibility  with respect to sample size and shape 
 
              - Allows the  length of the scribe to be varied from 1 to 100mm 
 
              - Enables precise and repeatable sample alignment and sizing with a  ruler embedded in platform              
 
              - Retains a capability  of scribing bonded crystalline and amorphous wafers and chips for subsequent cleaving 
 
             
              Operation
          The  sample is placed face up on the bed of the PELCO® FlipScribe®, with the left rail being used to set the position of the scribe and being locked in  place. The depth and angle of the scriber tip is adjustable, with the optimal  depth and angle depending on the sample type. The stop is set to prevent the  blue bar from impacting the sample, and the sample is drawn over the scriber  tip to make the scribe. A variety of sample holders are available with many form  factors including standard wafer sizes, down to individual small dies. After  scribing, the cleave is made using cleaving pliers. 
          Technical Note, PELCO® FlipScribe® Sample Holders (719KB PDF)  |