Specifications
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Sputter head |
Low voltage planar magnetron
Quick target change
Wrap-around dark-space shield
Shutter for target conditioning
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Targets |
Cr, Pt/Pd (standard) or IR (Iridium coater) optional: Au, Au/Pd, Cu, Ni, Pd, Pt, Ta, Ti and W |
Sputter supply |
Microprocessor based
Safety interlock
Constant current control independent of vacuum Digitally selectable current (20, 40, 60 or 80mA) |
Chamber size |
150mm OD (6")
Variable height, 165 - 250mm (6.5" - 9.8") including glass cylinder (65mm
H and 2 metal spacer rings)
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Sample stage |
Non-repetitive rotary, planetary motion with manual tilt 0-90°
Variable speed rotation
Crystal head
4 sample holders (specify when ordering, see Sample Holders)
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Analog metering |
Vacuum Atm - .001mb
Current 0-100mA
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Control method |
Automatic operation of gas purge and leak functions
Automatic process sequencing
Digital timer (0-300 sec) with pause
Automatic venting
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Thickness control |
MTM-20 controller with terminating facility
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Pumping System
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Configuration |
Turbo drag / rotary pump combination
Optional
dry scroll pump instead of rotary pump
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Pumping speed |
300 l/min at 0.1mb
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Pumpdown Time |
1 min to 1 x 10-3mb
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Ultimate pressure |
1 x 10-5mb
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Desktop system |
Rotary pump is mounted on desktop compatible anti-vibration table
All metal vacuum coupling system
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Thickness Controller
|
MTM-20 |
Microprocessor based
4 digit display, push button zero
6MHz crystal with lifetime check
5 times/sec update rate ( more information) |
Thickness range |
0.0 - 999.9nm
|
Resolution |
Better than 0.1nm
|
Density range |
0.50 - 30.00gm/cm3 |
Tooling factor range |
0.25 - 8.00
|
Termination range |
0 - 999.9nm
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Services Required
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Electrical |
100-120 or 200-240VAC, 50/60Hz, (please specify)
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Power |
550VA max.
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Argon gas |
Purity, min. 99.995%
Pressure regulated 5 - 6 psi (0.4 bar)
Hose connection, 6.0mm (1/4") ID hose
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System Dimensions
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Size |
Width 600mm (23.6"), Depth 600mm (23.6"), Height 450mm (17.7") (with rotary pump)
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Weight |
40kg (88.5 lbs) (with rotary pump)
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