Specifications
|
| Sputter head |
Planar magnetron
Quick target change
Wrap-around dark-space shield
Shutter for target conditioning
|
| Targets |
Cr, Pt/Pd, Ir (see full target list) |
| Sputter supply |
Microprocessor based
Safety interlock
Constant current control independent of vacuum
Digitally selectable current (20, 40, 60 or 80mA) |
| Chamber size |
150mm OD (6")
Includes short 65mm chamber. Vertical deposition distances to RPT can be varied by the addition of 15mm height metal spacer rings (2 included). Optional stationary stage with tall 150mm chamber and additional spacer ring available (#7021-208HR). |
| Sample stage |
Non-repetitive rotary, planetary motion with manual tilt 0-90°
Variable speed rotation
Crystal head
4 sample holders (specify when ordering, see Sample Holders)
|
| Analog metering |
Vacuum Atm - 0.001mb
Current 0-100mA
Voltage 0 – 500V |
| Control method |
Automatic operation of gas purge and leak functions
Automatic process sequencing
Digital timer (1-600 sec) with pause
Automatic venting
|
| Thickness control |
MTM-20 controller with terminating facility
|
Pumping System
|
| Configuration |
Turbo/diaphragm backing pump combination |
| Pumping speed |
67 l/sec.
|
| Pumpdown Time |
Approximately 10 min. to 4 x 10-5 mbar
|
| Ultimate pressure |
Approximately 8 x 10-6 mbar |
Thickness Controller
|
| MTM-20 |
Microprocessor based
4 digit display, push button zero
6MHz crystal with lifetime check
5 times/sec update rate (more information) |
| Thickness range |
0.0 - 999.9nm
|
| Resolution |
0.1nm
|
| Density range |
0.50 - 30.00gm/cm3 |
| Tooling factor range |
0.25 - 8.00
|
| Termination range |
0 - 999.9nm
|
Services Required
|
| Electrical |
100-120 or 200-240VAC, 50/60Hz, (please specify)
|
| Power |
550VA max.
|
| Argon gas |
Purity, min. 99.995%
Pressure regulated 5 - 6 psi (0.4 bar)
Hose connection, 6.0mm (1/4") ID hose
|
System Dimensions
|
| Size |
Width 600mm (23.6"), Depth 600mm (23.6"), Height 450mm (17.7") (with pump)
|
| Weight |
40kg (88.5 lbs) (with pump) |