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Rigid mount caps to protect metallographic or petrographic mounts with 1", 1-1/4", 1-1/2"or 2" diameter. Made of black polethylene. Height approximately 1/2" (12.7mm). Sold in packs of 25 for 1", 1-1/4", 1-1/2" and in pack of 10 for 2" diameter.
Graphite filled, conductive, compression mount material for hot embedding. Ideal for SEM, EDS/WDS and electro polishing applications. Hard embedding material with low electrical resistance and excellent edge retention. Enables imaging and analysis of clean, uncoated sample surfaces of conductive materials in the SEM, FESEM, EPMA or FIB systems. Hot embedding press is needed to use this embedding material. Embedding temperature 165°-200°C (330°-425°F) with a moulding pressure of 17-28 MPA (2500-4000 PSI). Typical curing time is 5-10 minutes.
SDS (114KB PDF)
This superior formulation of silicone mold release is particularly useful for easy release of cold or hot embedding molds. Cured resin embedding can be easily removed from plastic embedding mold when a thin layer of silicone mold release is sprayed on the inside of the mold. Apply a thin coat before loading sample and embedding powder (phenolic, Lucite, epoxy or diallyl phatalate) in hot embedding presses. Also prevents sticking of materials such as plastics, rubber and waxes to molds. Contains no CFC, HCFC or chlorinated solvents. Temperature Range: 40°F to 500°F (5°C to 260°C).