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Manual sectioning saw designed for cutting printed circuit boards, ceramics,
metal samples and composite components. Can also be used as a cut-off saw for
small rods, wires, bars and tubes. Large working area of 6 x 10" with coolant
bath below. The saw housing and table are made of non-corroding sturdy cross linked
polyethylene to ensure durability. Powerful 1/4 HP (115V/1.75A/200W) motor with approximate variable speed of 400-3250
rpm, allows for selecting the best cutting speed for a variety of sample materials.
Uses 4 and 5" diamond wafering blades with 5/8" (16mm) holes.
Includes a 4" diamond wafering blade with medium/coarse grit in high concentration (#812-316-5), dressing stick and water soluble coolant.
Maximum cutting width: 3-1/2"
Maximum cutting depth: 4" blade = 1"; 5" blade = 1-1/2"
230V version is NOT available; use #54585, 500W Step Down
Transformer with 230V power outlets.
A variety of Diamond, cBN, and SiC 3", 4", and 5" diameter wafering blades are available for this saw.
PELCO® High Quality Diamond cBN, & SiC Wafering Blades
Made in USA
| Prod #
| Description
| Unit
| Price
| Order / Quote
|
| 812-300
| XP Sectioning Saw, 115V, each
| each
| $975.00
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