Manual sectioning saw designed for cutting printed circuit boards, ceramics,
metal samples and composite components. Can also be used as a cut-off saw for
small rods, wires, bars and tubes. Large working area of 6 x 10" with coolant
bath below. The saw housing and table are made of non-corroding sturdy cross linked
polyethylene to ensure durability. Powerful 1/4 HP (115V/1.75A/200W) motor with approximate variable speed of 400-3250
rpm, allows for selecting the best cutting speed for a variety of sample materials.
Uses 4 and 5" diamond wafering blades with 5/8" (16mm) holes.
Includes: 4" Diamond Wafering Blade with medium/coarse grit in high concentration (#812-316-5), Dressing Stick and Water Soluble Coolant.
Maximum cutting width: 3-1/2"
Maximum cutting depth: 4" blade = 1"; 5" blade = 1-1/2"
230V version is NOT available; use 500W Step Down
Transformer (#54585) with 230V power outlets.
PELCO® Diamond Wafering Blades & Supplies
Made in USA
| Prod #
| Description
| Unit
| Price
| Order / Quote
|
| 812-300
| XP Sectioning Saw, 115V
| each
| $975.00
|
|
| Diamond Wafering Blades with 5/8" Arbor for XP Sectioning Saw
|
| 812-315-5
| Diamond Wafering Blade, 4" x 0.012" x 5/8" hole, medium/fine grit - low concentration
| each
| 247.50
|
|
| 812-316-5
| Diamond Wafering Blade, 4" x 0.012" x 5/8" hole, medium/coarse grit - high concentration
| each
| 229.90
|
|
| 812-317-5
| Diamond Wafering Blade, 4" x 0.012" x 5/8" hole, fine grit - high concentration
| each
| 229.90
|
|
|