Your Secure Session, is about to expire in seconds.
For more information, please read our Privacy Policy.
The XP Diamond Band saw is the newest member of our XP line of cutting and polishing equipment. This lightweight bandsaw is designed for medium precision, efficient cutting of hard and brittle materials. The saw is also rugged enough to cut through materials such as soft metals and polymers while keeping a small footprint on the lab bench Samples can be hand fed into the blade by hand or using the miter jig. The diamond plated, steel core blades are designed for long life under normal conditions. Easy blade access and replacement procedures make occasional saw maintenance extremely simple. Coolant, typically water, is contained in a large reservoir in the base of the saw. Other cutting fluids are not recommended.
The XP Diamond Band Saw ships with one blade that needs to be installed before use.
Features:
The Dressing Stick is used to expose the cutting diamonds, to improve cutting rate and to reduce heating at the cutting edge. Especially useful when cutting softer material where the cut material tends to "clog up" the cutting edge of the blade. Size is 12.5 x 12.5 x 152mm (0.49 x 0.49 x 5.98").
This compact 8"/20.3cm Grinder, Lapper, Polisher is well suited for manual finishing of specimens using grinding, lapping and polishing (cloths) discs as well as diamond and aluminum oxide films. The housing is made from sturdy, non-corroding plastic. The durable 1/4 hp motor has a variable speed control for 700-2800 rpm to select the optimum speed for grinding or polishing. The XP 20 includes a flexible and adjustable water spout for grinding, lapping and polishing applications. The XP 20 also comes with a standalone fluid supply system for use where running water or drainage is not available or not advised. When using the standalone fluid supply system, slurries and suspensions as well as water may be dispensed. The XP 20 Grinder/Polisher is also compatible with the PELCO® Abrasive Dispenser for timed, hands-free dispensing of fresh abrasive during grinding and polishing.This grinder/polisher is ideally suited for smaller labs and priced so that you can afford multiple dedicated XP 20 Grinder/Polishers.
The XP 20 is supplied with both standard and standalone plumbing components, one 8" Aluminum Platen, one Splash Guard, and one Plain Paper Retainer Ring.
The 8" Aluminum Platen (#812-372) of the XP 20 Grinder/Polisher is of the screwback type (leaving a flat surface on top) and can be easily exchanged for platens with other grinding/lapping/polishing discs. Flexible PSA-backed Magnetic Discs (#816-129) are available to accommodate use of magnetic polishing cloths
go to Grinding & Lapping Discs | Polishing Cloths (Discs)
Consumables for use with the XP 20 Grinder/Polisher: Grinding Discs & Films Lapping Films Polishing Cloths Polishing Compounds, Paste, Sprays, Suspensions Metal Cleaning/Polish Compounds
Manual sectioning saw designed for cutting printed circuit boards, ceramics, metal samples and composite components. Can also be used as a cut-off saw for small rods, wires, bars and tubes. Large working area of 6 x 10" with coolant bath below. The saw housing and table are made of non-corroding sturdy cross linked polyethylene to ensure durability. Powerful 1/4 HP (115V/1.75A/200W) motor with approximate variable speed of 400-3250 rpm, allows for selecting the best cutting speed for a variety of sample materials. Uses 4 and 5" diamond wafering blades with 5/8" (16mm) holes.
Includes: 4" Diamond Wafering Blade with medium/coarse grit in high concentration (#812-316-5), Dressing Stick and Water Soluble Coolant.
Maximum cutting width: 3-1/2" Maximum cutting depth: 4" blade = 1"; 5" blade = 1-1/2"
230V version is NOT available; use 500W Step Down Transformer (#54585) with 230V power outlets. PELCO® Diamond Wafering Blades & Supplies