Specifications
|
| Sputter head |
Planar magnetron
Removable, plug in sputter head
Shutter for target conditioning |
| Targets |
Cr, Pt/Pd, Ir (see full target list) |
| Sputter supply |
Microprocessor based
Safety interlock
Constant current control independent of vacuum
Digitally selectable current (20, 40, 60 or 80mA) |
| Chamber size |
180mm OD (7")
Includes short 65mm chamber. Vertical deposition distances to Rotary-Tilting Stage can be varied by the addition of 15mm tall metal spacer ring, 30mm tall, or combination of both. |
| Sample stage |
Rotary-Tilting Stage with variable speed rotation and manual tilt
4" diameter wafer table as standard. Optional Sample Tables are available, accommodating sample sizes up to a 6" wafer.
|
| Analog metering |
Vacuum Atm - 0.001mb
Current 0-100mA
Voltage 0 – 500V |
| Control method |
Automatic operation of gas purge and leak functions
Automatic process sequencing
Digital timer (1-600 sec) with pause
Automatic venting
|
| Thickness control |
MTM-20 controller with terminating facility
|
Pumping System
|
| Configuration |
Turbo/diaphragm backing pump combination |
| Pumping speed |
67 l/sec.
|
| Pumpdown time |
Approximately 10 min. to 5 x 10-5 mbar
|
| Ultimate pressure |
Approximately 8 x 10-6 mbar |
Thickness Controller
|
| MTM-20 |
Microprocessor based
4 digit display, push button zero
6MHz crystal with lifetime check
5 times/sec update rate (more information) |
| Thickness range |
0.0 - 999.9nm
|
| Resolution |
0.1nm
|
| Density range |
0.50 - 30.00gm/cm3 |
| Tooling factor range |
0.25 - 8.00
|
| Termination range |
0 - 999.9nm
|
Services Required
|
| Electrical |
100-120 or 200-240VAC, 50/60Hz, (please specify)
|
| Power |
550VA max.
|
| Argon gas |
Purity, min. 99.995%
Pressure regulated 5 - 6 psi (0.4 bar)
Hose connection, 6.0mm (1/4") ID hose
|
System Dimensions
|
| Size |
Width 600mm (23.6"), Depth 600mm (23.6"), Height 465mm (18.3") (with pump)
|