Wash away adhesives are ideal for temporary mounting of products that require dicing, polishing and other machining processes.
They exhibit high bond strength and adhere readily to metals, glass and ceramics by melting with heat. When processing is complete,
the adhesives are removed by reheating and cleaning with environmentally friendly cleaning agents.
Typical Applications:
- machining advanced ceramics
- lapping and polishing optical components
- dicing ceramic substrates and semiconductor wafers
- dicing ferrites, glasses and piezoelectrics
- dicing metal and optical single crystals
- mounting cross-sections for electron microscopy
- backfilling components for temporary mechanical support
Crystalbond™ 509
Provides excellent adhesion and minimizes clogging of diamond tools compared to waxes.
They are transparent in thin cross-sections. Soluble in acetone, odorless, non-flammable,
biodegradable and may be rinsed in water.
Crystalbond™ 555 & 555-HMP
A low melting point adhesive for moderate stress machining processes. It is transparent in
thin cross-sections and is soluble in hot water. 555 has a Flow Point of 120ºF
(54ºC); 555-HMP is 150ºF (66ºC);
Crystalbond™ 590
A high strength, resilient adhesive system, ideal for doing miniature and tall parts.
It is soluble in methanol or IPA, a water-dispersible, environmentally safe powder concentrate.
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