Home Page	Abbreviated Contents	Customer Login		Quick Order / View Order
Contact Us	Search	Indexes		Finish Order

back to Adhesives
back to Materials Science
Wax Cleaning Product

Sample Mounting Adhesives

mounting adhesive for temporary mounting of products that require dicing, polishing and other machining processes in preparation of samples for materials science microscopy examinations

Crystalbond™ Mounting Adhesives
Wafer-Mount™ 559 Mounting Adhesive
Wafer-Mount™ 562 Mounting Adhesive
Wafer-Mount™ 562-S Stripper
Epoxy Bond 110 - M-Bond™ 610
PELCO SampleBond™ and PELCO® Pro Cyanoacrylate Debonder
Loctite® 460 Sample Bonding Adhesive

Crystalbond™ Mounting Adhesives
Crystalbond™ 509, 555 and 590	Crystalbond™ 509 bonds an advanced ceramic which is diced into 25-50 mil sections.

Wash away adhesives are ideal for temporary mounting of products that require dicing, polishing and other machining processes. They exhibit high bond strength and adhere readily to metals, glass and ceramics by melting with heat. When processing is complete, the adhesives are removed by reheating and cleaning with environmentally friendly cleaning agents.

Typical Applications:

machining advanced ceramics
lapping and polishing optical components
dicing ceramic substrates and semiconductor wafers
dicing ferrites, glasses and piezoelectrics
dicing metal and optical single crystals
mounting cross-sections for electron microscopy
backfilling components for temporary mechanical support

Crystalbond™ 509
Provides excellent adhesion and minimizes clogging of diamond tools compared to waxes. They are transparent in thin cross-sections. Soluble in acetone, odorless, non-flammable, biodegradable and may be rinsed in water.

Crystalbond™ 555 & 555-HMP
A low melting point adhesive for moderate stress machining processes. It is transparent in thin cross-sections and is soluble in hot water. 555 has a Flow Point of 120ºF (54ºC); 555-HMP is 150ºF (66ºC);

Crystalbond™ 590
A high strength, resilient adhesive system, ideal for doing miniature and tall parts. It is soluble in methanol or IPA.

Type	509-1 \| 509-3	555 \| 555-HMP	590
Trade Name	Crystalbond™	Crystalbond™	Crystalbond™
Form	Stick	Stick	Stick
Size	7/8" dia. x 7"	1/2" x 1" x 7"	5/8" x 1-1/4" x 7-1/2"
Weight	~.2 lbs./stick	~.15 lbs./stick	~.5 lbs./stick
Flow Point °F (°C)	250 (121)	120 (54) / 150 (66)	302 (150)
Viscosity, cps	6,000	500	9,000
Color	Light Amber \| Clear	White	Brown
Solvent	Acetone	Hot Water	Methanol or IPA

Crystalbond™ Adhesive Stick Ordering Information

Prod # Description Unit Qty Price Order / Quote

821-1
Crystalbond™ 509-1, 90 gr, light amber
each
1-4
$26.90

Qty:

5+
25.55

821-3 Crystalbond™ 509-3, 90 gr, clear each 1-4 27.20

Qty:

5+ 24.48

821-2 Crystalbond™ 555, 68 gr each 1-9 18.50

Qty:

10+ 17.60

821-6 Crystalbond™ 555-HMP, 68 gr each 1-9 19.35

Qty:

10+ 18.38

821-4 Crystalbond™ 590, 227 gr each 1+ 43.50

Qty:

PELCO® Technical Notes, Crystalbond™ Adhesive (PDF File)

Wafer-Mount™ 559 Mounting Adhesive

plastic film peeled away from paper backing and specimen about to be mounted

Wafer-Mount™ 559 A clear adhesive on a plastic film that is ideal for holding silicon wafers, alumina, or glass substrates for scribing. No heating is required; just remove the paper backing to expose the adhesive layer, position the wafer substrate on the film and press down with firm pressure to insure adhesion. A vacuum manifold or mechanical device may be used to hold wafer/plastic film during dicing or scribing. After dicing or scribing acetone or MEK may be used to separate the specimen from the Wafer-Mount™ 559. Size is 10" x 10" x .005" thick in packages of 2.

Ideal for scribing/dicing wafers with vacuum hold down fixturing

Specifications

Form	Sheet
Size	0.005" x 10" x 10" (0.127mm x 254mm x 254mm)
Color	Clear
Solvent	Acetone or MEK

Application Procedures:

Cut the Wafer-Mount™ sheet to the desired shape and size and peel the clear plastic tape away from the backing paper. Place the substrate, face down, over the part. Press firmly to assure good adhesion, then peel off the backing paper.
Process the substrate as required, then remove parts by heating in a well ventilated area to 300°F for 2-3 minutes until the adhesive softens. Use a tool to slide the substrate off the mounting plate.
Clean with acetone or MEK.

2", 3", and 4" silicon wafers

Prod # Description Unit Qty Price Order / Quote

821-7
Wafer-Mount™ 559 Mounting Adhesive
pkg/2
1-4
$29.00

Qty:

5+
24.00

Wafer-Mount™ 562 Mounting Adhesive

Thermoplastic white film adhesive with good adhesive properties. Ideal for mounting thin, fragile substrates for which a predictable film thickness is required. Flow point is 200°F (93°C). Soluble in 562-S Stripper. A non-flammable, biodegradable, water-rinsable solvent. Size is 8" x 10" x .003" thick in packages of 10.

Prod # Description Unit Price Order / Quote

821-8
Wafer-Mount™ 562 Mounting Adhesive
pkg/10
$75.00

Qty:

Wafer-Mount™ 562-S Stripper

Remove Wafer-Mount™ and other polymer coatings. Environmentally-safe, low evaporation rate, water rinsable, non-flammable, biodegradable and non-reactive with metals. Recommended for use in an ultrasonic cleaner. Rinse with warm water. Use with protective gloves, eye goggles and ventilation or fume hood.

Prod # Description Unit Price Order / Quote

821-9
Wafer-Mount™ 562-S Stripper
1 lb.
$91.80

Qty:

Epoxy Bond 110

Epoxy Bond 110 is a very low viscosity, hard and fast-curing epoxy with excellent bonding characteristics. A unique feature of Epoxy Bond 110 is the red color that appears on curing. Cure by color instead of time. It is a reactive system only when heat is applied. It has good adhesion to many materials including metals, ceramics, glass and most plastics. Use for IC Cover Slip Technique when IC does not have passivation layer, when rounding occurs during cross-sectioning, or in the semiconductor field for bond pad protection.
Part A MSDS; Part B MSDS

Prod # Description Unit Price Order / Quote

16028
Epoxy Bond 110
each
$68.50

Qty:

M-BOND™ 610 Adhesive

ion milling, cross-sectioning

This is a non-conductive, two-component, solvent-thinned, epoxy-phenolic adhesive for high performance applications. Chemically resistant and provides a thin layer of glue which has good ion milling properties. It has low viscosity and is extremely thin, with minimum creep, hysteresis and linearity problems. Solids content is 22%. It is an excellent adhesive for mounting samples for TEM dimpling and bonding of samples to TEM grids for imaging or FIB.

Operating temperature range, short term is -269° to +370°C (-452° to +698°F); long term, -269° to +260°C (-452 to +500°F).
Elongation can occur at +24°C (3%). This may be the widest temperature range general-purpose adhesive that is available.
A kit contains: 4 bottles (14g each) Resin; 4 bottles (11g each) Curing Agent; 4 brush caps for dispensing mixed adhesives; 4 disposable mixing funnels and instructions.
M-BOND™ Adhesive MSDS; M-BOND™ Adhesive Curing Agent MSDS

Prod # Description Unit Price Order / Quote

16039
M-Bond™ 610, complete kit
each
$134.50

Qty:

PELCO® SampleBond™ Adhesive

The PELCO® SampleBond™ Adhesive on the basis of cyanoacrylate has been especially developed for sample bonding to supports. It is a thin, fast curing adhesive which can be used as a cleaner alternative to wax for mounting samples to glass for TEM/FIB thinning procedures. Ideal for bonding metals, silicon, ceramics and other non-porous materials to similar materials or to glass. Can also be used to bond thin samples together for cross section procedures. Samples glued with PELCO® SampleBond™ can be easily debonded (removed) from the support by using #19920 PELCO® Pro cyanoacrylate debonder. Supplied in 20ml bottle with dispenser tip, closed with ptfe coated steel pin for optimum seal.
I - MSDS

Prod # Description Unit Price Order / Quote

16024
PELCO® SampleBond™ Adhesive, 20ml
each
$15.90

Qty:

PELCO SampleBond™ - Cyanoacrylate Debonder Kit

PELCO® SampleBond™ / PELCO® Pro Cyanoacrylate Debonder Kit

Conveniently packaged kit with PELCO® SampleBond™ Adhesive for sample bonding on glass supports and PELCO® Pro Cyanoacrylate Debonder (see description below) to remove the sample after thinning. Kit contains two ea. 20ml bottles with dispenser tips.

PELCO® SampleBond™: I - MSDS
PELCO® Pro Cyanoacrylate Debonder: F, Cg, I, T - MSDS

Prod # Description Unit Price Order / Quote

16025
PELCO Samplebond™ / Cyanoacrylate Debonder Kit, 20ml + 20ml
each
$18.50

Qty:

The shelf life of cyanoacrylate glues (and epoxies) can be extended by storing them at lower temperatures; -20°C. At lower temperatures, the adhesive becomes very viscous and the speed of chemical reactions is practically reduced to zero. It will keep the adhesive stable for years. Before use, let the adhesive thaw with the container sealed to avoid condensation into the adhesive.

PELCO® Pro Cyanoacrylate Debonder

The PELCO® Pro Cyanoacrylate Debonder destabilizes and debonds cured cyanoacrylates. Useful for releasing specimens from holders, cleaning cyanoacrylates from surfaces and removing cured cyanoacylates from fingers. Works on all brands of cyanoacrylate glue (Loctite, Henkel, Permabond, 3M™, PELCO®, Aron Alpha, etc.). The debonder is also a solvent, please check before using on plastic surfaces / samples and avoid repeated skin contact. Supplied in 20ml bottle with dispenser tip.
F, Cg, I, T - MSDS

Prod # Description Unit Price Order / Quote

19920
PELCO® Pro Cyanoacrylate Debonder, 20ml
each
$5.69

Qty:

Loctite® 460 Sample Bonding Adhesive

Loctite® 460 is a fast curing, thin glue which can be used as and alternative to wax for mounting samples to glass for TEM/FIB Thinning. Soluble in acetone.

MSDS (PDF 48KB)

Prod # Description Unit Price Order / Quote

16029
Loctite 460 Sample Bonding Adhesive, 20g
each
$27.80

Qty:

back up