XP Precision Sectioning Saw
and Diamond Sectioning / Wafering Blades

Prod #	Description	Unit	Price	Order / Quote
812-300	XP Precision Sectioning Saw, 115V, each	each	$975.00	Qty:

Diamond Sectioning / Wafering Blades Can be used on all popular precision sectioning and cutting saws from PELCO, Buehler, LECO, Struers, Allied and many others. These competitively priced Smart Cut™ precision diamond wafering blades are designed to provide superior smooth surface quality, low-distortion sectioning and enhanced blade life. The man-made diamond crystals in the Smart Cut™ diamond sectioning blades / wafering blades are oriented in such a way that diamonds are only activated at the exposed layer. As the exposed layer begins to wear out, diamonds in a new layer are activated, keeping up the cutting rate.

The advantages are:

• Faster cutting action – leaves smooth finish
• Less glazing – requires minimal dressing
• More universal – compatible with a greater variety of materials
  

All Smart Cut™ diamond blades have a metal bonded diamond height of 4mm and are available in 3, 4, 5 & 6" diameter with the industry standard 1/2" or 5/8" arbor holes. Three grades are offered to fit most applications:

• LC200MF medium/fine grit – low concentration for hard and tough materials, hard coating, hard ceramics and concrete ( equivalent to Buehler 15LC)
• HC150MC medium/coarse grit - high concentration for composite materials, PCB, soft metals and bone (equivalent to Buehler 15HC)
• HC320F fine grit – high concentration for glass fiber and carbon composites, soft ceramics and optical materials (equivalent to Buehler 5LC and 10LC)

Prod #	Description	Unit	Price	Order / Quote
1/2" Arbor Hole for Buehler, Struers, Allied and many others
812-310	Diamond Wafering Blade, 3" x 0.010" x 1/2" hole, medium/fine grit - low concentration	each	$165.00	Qty:
812-311	Diamond Wafering Blade, 3" x 0.010" x 1/2" hole, medium/coarse grit - high concentration	each	165.00	Qty:
812-312	Diamond Wafering Blade, 3" x 0.010" x 1/2" hole, fine grit - high concentration	each	165.00	Qty:
812-315	Diamond Wafering Blade, 4" x 0.012" x 1/2" hole, medium/fine grit - low concentration	each	194.50	Qty:
812-316	Diamond Wafering Blade, 4" x 0.012" x 1/2" hole, medium/coarse grit - high concentration	each	194.50	Qty:
812-317	Diamond Wafering Blade, 4" x 0.012" x 1/2" hole, fine grit - high concentration	each	194.50	Qty:
812-320	Diamond Wafering Blade, 5" x 0.015" x 1/2" hole, medium/fine grit - low concentration	each	209.50	Qty:
812-321	Diamond Wafering Blade, 5" x 0.015" x 1/2" hole, medium/coarse grit - high concentration	each	209.50	Qty:
812-324	Diamond Wafering Blade, 5" x 0.015" x 1/2" hole, fine grit - high concentration	each	209.50	Qty:
812-325	Diamond Wafering Blade, 6" x 0.020" x 1/2" hole, medium/fine grit - low concentration	each	209.50	Qty:
812-326	Diamond Wafering Blade, 6" x 0.020" x 1/2" hole, medium/coarse grit - high concentration	each	209.50	Qty:
812-327	Diamond Wafering Blade, 6" x 0.020" x 1/2" hole, fine grit - high concentration	each	209.50	Qty:
5/8" Arbor Hole for PELCO XP-300, PELCO CS600A and PCS-400
812-316-5	Diamond Wafering Blade, 4" x 0.012" x 5/8" hole, medium/coarse grit - high concentration	each	209.00	Qty:
812-317-5	Diamond Wafering Blade, 4" x 0.012" x 5/8" hole, fine grit - high concentration	each	209.00	Qty:
812-326-5	Diamond Wafering Blade, 6" x 0.020" x 5/8" hole, medium/coarse grit - high concentration	each	209.50	Qty:

cutting fluid, soluble oil (recommended)