1. Advanced 308R Pumping System and Vacuum Chamber
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The 308R system is a unique versatile compact desktop vacuum coating system. It is packed with new features and the latest vacuum technology to ensure fast and clean pumping coupled to smooth operation. The advanced wide range turbo pump can be optimized for either evaporation (E-Beam or thermal) or for sputtering / glow discharge with a single touch of a button. This truly revolutionary desktop pumping system is fully gauged, features electronic valves and is microprocessor controlled for automatic pump down and venting sequences. Precision gas leak for sputter gas and separate dry venting line are standard. All functions are readily accessible via manual operation for increased flexibility. A well maintained system routinely pumps down into the 10-7 mbar range using the high speed mode of the turbo pump. The 308R is now equipped with a light weight stainless steel chamber featuring two windows (75 and 100mm) and 2 KF40 flanges. The standard 9-port KF40 feedthrough collar has an internal mounting ring for the deposition sources.
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| All connections for the thermal evaporation sources, sputtering heads, E-Beam sources, glow discharge cleaning head, thickness monitor, shutters and rotary/tilt stages are on the 9-port feedthrough collar. All power supplies are compact standalone units, positioning aside the pumping station, enabling the user optimum and easy configuration at any time.
The Cressington 308R Vacuum Chamber is manufactured using annealed stainless steel for improved vacuum performance. The light weight construction makes it easy to remove the chamber to access the deposition sources or the substrate.
Advantages of the Cressington 308 Vacuum Pumping System:
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- Vacuum chamber and pumping manifold from annealed stainless steel gives near UHV clean vacuum performance
- Light weight stainless steel chamber with separate dome for improved accessibility and safety
- Fully indexed collar, chamber and dome for easy assembly
- Compact system for both sputter and evaporation operation
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2. LT 750 Low Power Thermal Evaporation for EM Applications
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The LT750 has been specifically designed for carbon and metal evaporation as used in electron microscopy applications. The carbon source works with stepped carbon rods and the metal source can accommodate filaments, baskets and boats. The LT750 has a dual source output with dual KF40 feedthroughs on the cables with safety switches on each feedthrough. It has a choice of 4 and 8 volts output with 185A and 90 respectively. |
3. LT1500 High Power Evaporation for Thin Film Analysis Applications
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The LT1500 high power supply has been specifically designed for thin applications. It also has a dual source output with two KF40 feedthroughs and safety switches on each feedthrough. The voltage selection is either 4 or 8 volts with 375A and 190A respectively. The LT1500 with the larger water-cooled evaporation sources uses 75 or 100mm long boats, baskets and mini-crucibles. It has enough power to drive baffle boats. The water cooling feedthroughs are mounted on a standard KF40 flange |
4. DC100 DC Magnetron Power Supply, Sputter Sources and Glow Discharge Cleaning
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The DC100 DC magnetron power supply has a dual output on a single KF40 feedthrough with a vacuum interlock integrated in the feedthrough. Up to two compact sputter sources or a combination of sputter head and glow discharge can be connected to one DC100 power supply. Sputter sources have a separate feedthrough, do not require water cooling and can be positioned anywhere in the chamber.
The DC100 is power supply is adjustable from 5-80 Watts. Operation is either manual, preset current or thickness controlled (needs the high resolution MTM-20 thickness controller). The sputter sources for the 308 use compact 38mm diameter targets. This allows for mounting up to 4 sputter heads in the vacuum chamber to accommodate either sputtering of multiple layers or co-sputtering of materials. Sputter sources can be conditioned or shielded by using shutter assemblies. The advanced vacuum system and precise leak valve setting gives excellent control over the argon sputter gas pressure resulting in a wide range of sputter rates.
The efficient glow discharge head used together with air as process gas gives excellent plasma/ion cleaning of substrates, TEM grids. With the glow discharge hydro carbons or biological material can also be etched.
DC Magnetron Head Assembly on Swinging Arm (Prod. No. 9520-20), is shown mounted on a standard KF40 feedthrough.
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5. EB500 Electron Beam Evaporation and EB Sources
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The EB500 power supply is a high performance single output E-beam power supply capable of driving the Cressington electron beam sources for carbon and platinum/carbon.
The EH53 carbon source is a directional rod-fed E-beam source designed to produce ultra-high resolution and ultra-thin carbon films for ultrastructural TEM applications. It can also be used for FESEM sample coating and demanding EBSD applications.
The EH52 Pt/C E-beam source is also a directional rod fed electron beam evaporation source specifically designed for low angle rotary shadowing work for high resolution TEM applications.
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| Both E-Beam carbon sources are also used in the highly acclaimed Cressington Freeze Fracture and Freeze Etching systems and are renowned for delivering consistent ultra high resolution coatings in EM applications. |
6. Substrate Stages
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| Feedthrough Collar with Rotary-Planetary-Tilting Stage |
Feedthrough Collar with Rotary-Tilting Stage |
There is a choice of substrate stages:
- A simple static table mounted in the center of the source mounting ring
- A rotary tilting (RT) stage with variable speed, having a choice of 4" or 8" stages
- An advanced rotating-planetary-tilting (RPT) stage with 4 sample holders
Both the RT and RPT stage use one KF40 flange for mounting. Standard configuration is for downward deposition, but upwards evaporation is available by mounting the RT or RPT stage in the top of the lightweight stainless steel vacuum chamber.
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7. Shutters
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The manual shutters can be used either for shielding the specimen or a source. Mounted on a standard KF40 feedthrough they can be positioned and moved through a control knob. The shutter blade can be easily repositioned on the shutter holder for optimum shielding and to adjust for different configurations. For specific applications a sputter source can be shielded with a stationary shutter mounted on the mounting ring. |
8. Precise MTM Film Thickness Measurement Systems
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MTM-10 Thickness Monitor for use with the 308R-EM Vacuum Coating System |
Each 308R is supplied with a precise high resolution MTM-10 thickness measurement system utilizing a 6Mhz quartz crystal. Using a thickness monitor is the only reliable method for controlling the coating thickness and to achieve consistent coating thickness. The MTM-10 can store four density and tooling factors and has a resolution of 0.1nm for a density of 2 g/cm3 (carbon). Optionally available is the MTM-20 thickness controller, which has an integrated termination facility for the DC100 sputter power supply. When using evaporation processes the MTM-20 is used as a thickness monitor system. |
