| Home Page | Abbreviated Contents | Customer Login | Quick Order / View Order | |
|---|---|---|---|---|
| Contact Us | Search | Indexes | Finish Order | |
go to Histology Adhesives
back to SEM Supplies and Accessories Overview
Conductive Adhesives
| Home Page | Abbreviated Contents | Customer Login | Quick Order / View Order | |
|---|---|---|---|---|
| Contact Us | Search | Indexes | Finish Order | |
 |
Adhesive TabsComposed of a thin film of strong nonconductive adhesive. Size of adhesive area is 11mm 7/16" (11mm) diameter which is appropriate for 1/2" SEM pin and cylinder mounts. Place the "press" portion of the tab on an SEM mount surface. After pressing, pull tab up and a thin layer of adhesive is left on the mount surface. Contents: 72 sheets, total of 2,592 tabs. |
|||||||||||||||||||||
|
||||||||||||||||||||||
 adhesive being applied to a specimen mount using Lift-N-Press  |
Lift-N-Press TabsA new, improved adhesive tab composed of a thin film of strong, nonconducting, 1/2" (12.7mm) diameter adhesive which has these properties:
|
|||||||||||||||||||||
 |
Tempfix™ Adhesive Specimen Mount Setexcellent for particulate specimens such as powders, particles, pollens, insects, dried samples and similar fine matter |
|||||||||||||||||||||
| Tempfix™ is a non-conductive thermoplastic hot melt adhesive resin, especially formulated for SEM studies. It does not contain solvents and is stable under high vacuum. Its adhesive characteristics appear in the 40-120°C range. Melting starts at 40°C and it becomes a thin fluid at 120°C, displaying a wide viscosity range. It has a very smooth surface and can be used in SEM imaging without interfering background. Preparing specimens requires a hot plate or heating block, aluminum sheets of 10x10x0.25mm used as specimen mounts, a metal cooling block and a pin stub type specimen holder with a side clamping screw on top. The aluminum sheet is warmed up to about 120°C and a small amount of Tempfix™ is applied and smoothed over the sheet. Excess resin is removed. After the sheet has cooled down, Tempfix™ is a solid smooth plastic surface. Particulate or other small samples may be sprinkled or applied on the solid plastic surface and the sheet is gently heated above 40°C to the desired viscosity. Use temperature to control viscosity and how far the particulates "sink" into the adhesive. Remove the sheet and cool it quickly on a metal block. Delicate specimens will likely not suffer heat damage. A thin conductive coating (sputtering or evaporation) might be needed for optimum imaging results. The aluminum sheet with the specimen can either be mounted on the supplied pin mount adapter with clamping screw or can be mounted on a specific SEM mount with a conductive adhesive carbon tab. I - MSDS Technical Notes (PDF 91KB) |
||||||||||||||||||||||
|
||||||||||||||||||||||
PELCO® High Performance Ceramic AdhesiveThe PELCO® High Performance Ceramic Adhesive has been especially developed for bonding and sealing ceramics, metals, quartz and glass for high vacuum, high temperature and cryo applications. It is a dispersion of alumina in an inorganic silicate aqueous solution. Comes in the form of a paste and can be easily applied with a brush or a spatula. Good mechanical strength is achieved within minutes at room temperature. Curing schedule is 2 hours at 93°C (200°F). Full properties are reached after curing. It provides both low electrical and thermal conductivity. Sold in 2 sizes: a container containing 1 pint (473ml) or a container containing 50 grams (approx. 22ml). |
||||||||||||||||||||||
Advantages:
For conductive applications consider Product #16047
|
||||||||||||||||||||||
 |
Mikrostik™ AdhesiveUltrathin sticky base, clear, suitable for small particles which are submerged by other adhesives. Applications cited include organic powders, pollen, seeds - for attachment to a SEM stub. Can be diluted with MEK. Dries quickly. Nonconductive.F, I - MSDS
|
|||||||||||||||||||||
|
The shelf life of cyanoacrylate glues (and epoxies) can be extended by storing them at lower temperatures; -20°C. At lower temperatures, the adhesive becomes very viscous and the speed of chemical reactions is practically reduced to zero. It will keep the adhesive stable for years. Before use, let the adhesive thaw with the container sealed to avoid condensation into the adhesive.
|
PELCO® Pro C100 Cyanoacrylate GluePELCO® Pro C100 CA glue has a viscosity of 100cps and a curing time of 4-10seconds, clear. Use to bond plastic, glass, ceramic, rubber to metal with moderately smooth surfaces, not ideal for porous materials. General purpose cyanoacrylate glue. Suitable for many applications.
|
||||||||||||||||||||||
PELCO® Pro F5 Cyanoacrylate GluePELCO® Pro F5 CA glue is a very fast bonding cyanoacrylate with a viscosity of 5cps with a curing time of 2-4 seconds, clear. Use for high speed bonding of dissimilar materials with smooth surfaces and minimal gap (0.002” / 50um), superior wicking properties. Not suitable for porous materials.
|
||||||||||||||||||||||
PELCO® Pro C5 Cyanoacrylate GluePELCO® Pro C5 CA glue is a fast bonding cyanoacrylate with a viscosity of 5cps and a curing time of 5-10 seconds. Use to bond any combination of metals, glass, plastics, rubber, ceramics or glass with smooth surfaces and minimal gap (0.002” / 50um), excellent wicking properties. Not suitable for porous material due to the low viscosity.
|
||||||||||||||||||||||
PELCO® Pro C300 Cyanoacrylate GluePELCO® Pro C300 CA glue has a higher viscosity with a longer curing time. Ideally suited when more careful positing is needed, surfaces are not smooth or for gaps up to 0.006” (150um). Curing time 10-15 seconds.
|
||||||||||||||||||||||
PELCO® Pro C1000 Cyanoacrylate GluePELCO® Pro C1000 CA glue has a high viscosity and a longer curing time. Ideally suited when more careful positing is needed, surfaces are not smooth or for gaps up to 0.008” (250um). Curing time 10-15 seconds.
|
||||||||||||||||||||||
PELCO® Pro CA-Gel Cyanoacrylate GluePELCO® Pro CA-Gel glue is a gel type cyanoacrylate with high viscosity, excellent gap fill up to 0.10” (250um) and extended curing time 20-25 seconds. Use to bond rough surfaces and repositioning after initial contact. Can also be mixed with Fine Silver Powder (#61-310, below) for a super fast drying, conductive adhesive.
|
||||||||||||||||||||||
 |
Fine Silver PowderHigh purity, high density fine silver powder for making conductive adhesives or embedding materials. Can be mixed with epoxies (# 14420 or #14443, below) for making conductive embedding material or with cyano acrylate gel (#14478, above) for a super fast drying, conductive adhesive to mount specimens. 99.99+% purity, particles size 7-15µm. |
|||||||||||||||||||||
|
||||||||||||||||||||||
 |
PELCO® SampleBond™ AdhesiveThe PELCO® SampleBond™ Adhesive has been especially developed for sample bonding to supports. It is a thin, fast curing cyanoacrylate type adhesive which can be used as a cleaner alternative to wax for mounting samples to glass for TEM/FIB thinning procedures. Ideal for bonding metals, silicon, ceramics and other non-porous materials to similar materials or to glass. Can also be used to bond thin samples together for cross section procedures. Samples glued with PELCO® SampleBond™ can be easily debonded (removed) from the support by using #19920 PELCO® Pro cyanoacrylate debonder. Supplied in 20ml bottle with dispenser tip, closed with ptfe coated steel pin for optimum seal. |
|||||||||||||||||||||
|
||||||||||||||||||||||
 |
PELCO® SampleBond™ / PELCO® Pro Cyanoacrylate Debonder KitConveniently packaged kit with PELCO® SampleBond™ Adhesive for sample bonding on glass supports and PELCO® Pro Cyanoacrylate Debonder (see description below) to remove the sample after thinning. Kit contains two ea. 20ml bottles with dispenser tips. |
|||||||||||||||||||||
|
||||||||||||||||||||||
 |
PELCO® Pro Cyanoacrylate DebonderThe PELCO® Pro Cyanoacrylate Debonder destabilizes and debonds cured cyanoacrylates. Useful for releasing specimens from holders, cleaning cyanoacrylates from surfaces and removing cured cyanoacrylates from fingers. Works on all brands of cyanoacrylate glue (Loctite, Henkel, Permabond, 3M™, PELCO®, Aron Alpha, etc.). The debonder is also a solvent, please check before using on plastic surfaces / samples and avoid repeated skin contact. Supplied in 20ml bottle with dispenser tip. |
|||||||||||||||||||||
|
||||||||||||||||||||||
|
Krazy Glue® PenNo mixing, no drip, no clogged tips. Contains cyanoacrylate adhesive; comes out one drop at a time. Clear, same as type 201. Bonds in seconds. |
|||||||||||||||||||||||||||||
|
The shelf life of cyanoacrylate glues (and epoxies) can be extended by storing them at lower temperatures; -20°C. At lower temperatures, the adhesive becomes very viscous and the speed of chemical reactions is practically reduced to zero. It will keep the adhesive stable for years. Before use, let the adhesive thaw with the container sealed to avoid condensation into the adhesive. |
||||||||||||||||||||||||||||||
|
Duco® CementDries fast, clear, tough. For china, glass, wood, metal, leather. Contains acetone and butylacetate solvents. Nonconductive. |
|||||||||||||||||||||||||||||
|
|
||||||||||||||||||||||||||||||
|
Super Fast EpoxySuper fast 2-part epoxy resin cement for bonding applications. Sets in minutes. Full bond overnight. Stick polymerized specimens on aluminum Specimen Slug Mounts. Will not dissolve in acetone or alcohol. Dual dispersing syringe.I - MSDS |
|||||||||||||||||||||||||||||
|
|
||||||||||||||||||||||||||||||
|
Loctite® 404 Quick-SetVibratome® and Microslicer applications and other quick-set tissue-slide uses.
|
|||||||||||||||||||||||||||||
|
Loctite® 460 Sample Bonding AdhesiveLoctite® 460 is a fast curing thin glue which can be used as an alternative to wax for mounting samples to glass for TEM/FIB Thinning. Soluble in acetone.
|
|||||||||||||||||||||||||||||
|
Epoxy Bond 110Epoxy Bond 110 is a very low viscosity, hard and fast-curing epoxy with excellent bonding characteristics. A unique feature of Epoxy Bond 110 is the red color that appears on curing. Cure by color instead of time. It is a reactive system only when heat is applied. It has good adhesion to many materials including metals, ceramics, glass and most plastics. Use for IC Cover Slip Technique when IC does not have passivation layer, when rounding occurs during cross-sectioning, or for in semiconductor field bond pad protection.Part A MSDS; Part B MSDS T, I - |
|||||||||||||||||||||||||||||
|
|
||||||||||||||||||||||||||||||
|
Poxy Pak™ Epoxyfast cure epoxy, dual eject syringe;
no measuring, no waste, no mess |
|||||||||||||||||||||||||||||
|
|
||||||||||||||||||||||||||||||
|
M-BOND™ 610 Adhesiveion milling, cross-sectioning |
|||||||||||||||||||||||||||||
|
Operating temperature range, short term is -269° to +370°C; long term, -269° to +260°C. Elongation can occur at +24°C (3%). This may be the widest temperature range general-purpose adhesive that is available. A kit contains: 4 bottles (14g each) Resin, 4 bottles (11g each) Curing Agent, 4 brush caps for dispensing mixed adhesives, 4 disposable mixing funnels and instructions. M-BOND™ Adhesive MSDS; M-BOND™ Adhesive Curing Agent MSDS I
|
||||||||||||||||||||||||||||||
 |
EPO-TEK® H70E Thermally Conductive EpoxyEPO-TEK® H70E is a two component, thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronics applications. It is an excellent heat-sinking adhesive and is recommended for thermal management applications where good heat dissipation is needed. EPO-TEK® H70E exhibits excellent handling characteristics and an extremely long pot life at room temperature. Easy to use; can be screen printed, machine dispensed, stamped or hand applied. Excellent adhesion to ferrous and non-ferrous metals, glass, ceramic, kovar and PCB. Can be cured very rapidly.Cure Schedule (minimum bond temperature/time) Properties (summary)
Technical Notes (135k pdf) |
|||||||||||||||||||||||||||||
|
||||||||||||||||||||||||||||||
|
3M™ Multipurpose Adhesive
F - MSDS (PDF/37KB) |
|||||||||||||||||||||||||||||
|
|
||||||||||||||||||||||||||||||
 |
3M™ Adhesive RemoverPowerful replacement for mineral spirits, solvents and other unfriendly cleaners. Ideally suited for removing used
grinding/lapping/polishing discs with PSA backing from their support discs. New food-grade citrus based 3M™ adhesive
remover is also very effective in removing overspray of any aerosol adhesives, grease,
oil, grime, tape residue, tar,
wax, etc. A solvent-free formulation that provides wipe-away convenience with no filmy residue. F |
|||||||||||||||||||||||||||||
|
||||||||||||||||||||||||||||||
|
Glue Gun
low temperature model |
|||||||||||||||||||||||||||||
|
A thermoplastic glue stick is used with a gun-type design to melt the glue and allow its application, for example, to an SEM specimen mount. Heavier and/or larger specimens, which might move during study when held with a tape or disc adhesive, will hold firmly in place when this type of adhesive is used to "seat" the specimen. Carbon coating the specimen and the adhesive will permit an electrical discharge path. A lower temperature range (100° to 120°C / 212°- 248°F) is preferable, such as our model 16068 to avoid possible damage to heat sensitive specimens. (Normal temperature for standard high temperature glue guns is in the 190° to 210°C / 374° to 410°F range). The glue hardens quickly so the specimen should be positioned promptly upon glue application. If re-positioning is required, the glue may be softened with the Glue Gun.
References: |
||||||||||||||||||||||||||||||
|
Hazard Warning Guides Used in the Following Listings
|
