EPO-TEK® Conductive Silver-Epoxy
H-22 EPO-TEK®- silver resin paste / liquid hardener: (100:4.5 ratio)
H20E EPO-TEK®- silver resin paste / silver resin paste hardener: (1:1 ratio)
100% solids, two component silver filled epoxy with a soft, smooth, thixotropic (becoming less
viscous when stirred or shaken) consistency designed specifically for chip bonding in microelectronic
and optoelectronic applications.
Excellent handling characteristics, extremely long pot life at room temperature for this electrically conductive
silver adhesive. High speed epoxy chip bonding systems are suitable for very fast cures, such as fast circuit
repairs. Can be screen printed, machine dispersed or stamped and can withstand wire bonding temperatures in the
range of 300 - 400°C.
Silver Conductive Epoxy, H-22 EPO-TEK®
Two component, silver-filled epoxy system, consisting of a silver resin paste and a liquid hardener
(100:4.5). It is a free flowing paste, 100% solids system characterized by outstanding high temperature
properties as well as excellent solvent, chemical and moisture resistance. It has a long pot life and is
fast curing at relatively low temperatures. Containing no solvents or thinners; it will not outgas. It
can be applied by brush, spatula or hypodermic needle. H-22 can be useful for small angle cleavage in
material science and semi-conductor applications. EPO-TEK® silver content is 60% by weight of composition.
NASA approved passes NASA low outgassing standard ASTM E595 with proper cure. Ref: http://outgassing.nasa.gov.
Mixing ratio for this product is 100 parts silver resin paste to 4.5 parts liquid hardener.
Cure Schedule (minimum bond temperature/time)
150°C .........5 minutes
120°C .......10 minutes
100°C .......20 minutes
80°C .......45 minutes
- Color: silver
- Consistency: smooth, flowing paste
- Sheet resistance 2 ohms/sq/mil
- Refrigeration: not required.
- Higher Viscosity (20,000cps)
Technical Notes, H-22 EPO-TEK® Silver Conductive Epoxy (160KB PDF)
F, I - 16016 SDS (214KB PDF)
Guide to working with Epoxies (2MB PDF)
Conductive Adhesives Comparison Table
Reworking Cured Epoxy (185KB PDF)