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specimen preparation adhesives for scanning electron microscopy
PELCO® Conductive Graphite Paintavailable in water or alcohol baseConductive graphite paint is ideal for mounting conductive and non-conductive SEM specimens on stubs. Non-conductive specimens may require additional conductive paths. Supplied with convenient applicator brush in cap. |
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Water Base (Graphite Paint)Water based graphite paint contains no hydrocarbons as solvents and will give less contamination. Flat surface texture. Average flake size 1µm. Service temperature: 149°C.Technical Notes, PELCO® Conductive Graphite Paint (PDF 120KB) I - MSDS Conductive Adhesives Comparison Table |
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Isopropanol Base (Graphite Paint)Flat surface texture. Average flake size 1µm. Service temperature: 200° C. |
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DAG-T-502 Carbon Paint(different name, same product as Electrodag 502)one component, ready to use Provides conductivity for SEM non-conductive samples which require grounding. |
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502 is a combination of specially processed carbon particles in a fluoroelastomer resin system.
It remains flexible over a temperature range of -40°C to 260°C and cures at room temperature.
502 resists oxidation and has good adhesion qualities. The diluent is methyl ethyl ketone (MEK) and has
fluid consistency. Solids content is 12.6%. Service temperature range is -40°C to 260°C. Conductive Adhesives Comparison Table The specimen mount surface should be clean and dry before application. Keep the container tightly capped when not in use and avoid breathing the vapor. PELCO® Technical Notes, Electrodag® 502, 30g (PDF/230KB) F, I - MSDS Varela AS, Luttrell MP, Howerth EW, Moore VA, Davidson WR, Stallknecht DE and Little, SE, 2004. First Culture Isolation of Borrelia lonestari, Putative Agent of Southern Tick-Associated Rash Illness. J Clin Microbiol 42(3): 1163–1169. Vizzier-Thaxton Y, Cox NA, Richardson LJ, Buhr RJ, McDaniel CD, Cosby DE, Wilson JL, Bourassa DV and Ard MB, 2006. Apparent Attachment of Campylobacter and Salmonella to Broiler Breed Rooster Spermatozoa. Poultry Science 85:619-624. Allen DJ and Didio LJA, 1976. Hartmannella and Culbertsoni as Revealed in Scanning Electron Microscopy. Ohio J Sci 76(4):167-171.
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Composition: 1-Methoxy-2 Propanol base 60% Ag Specific Gravity = 2.25 g/cc. Viscosity = 455 poise |
PELCO® Conductive Liquid Silver Paint
a reliable conductive ground path for SEM specimens |
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"Leitsilber" Conductive Silver Cementa reliable conductive ground path for SEM specimens |
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PELCO® Conductive Silver 187PELCO® Conductive Silver 187 is a dispersion of finely divided silver in an acrylic resin. It is specially formulated for applications demanding the use of low VOC products. It provides high conductivity at very thin dry film thickness on plastic and other nonconductive substrates. It's sheet resistance is 0.015 ohms/sq/mil (25µm). It exhibits excellent environmental aging stability with superior scratch/mar resistance while providing excellent long-term shielding and grounding properties. Surfaces to be coated should be clean and dry.
PELCO® Technical Notes, PELCO® Conductive Silver 187 (PDF/421KB) |
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Typical Properties (as supplied)
Typical Properties (as applied) Typical Properties (when dried)
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PELCO® Colloidal Silver Paste, ConductiveIdeal where a nonflowing paste is needed for special applications. Particle size: 0.4-1.0µm, 80% are below 1.0µm. Cures in 16-20 hours, or 30 minutes @125-150°C. Clear lacquer base. Approximate Specific Gravity 2.25g/cc3. Service temperature = 200°C |
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PELCO® Conductive Gold Pasteresistant to oxidation and retains measurement integrity over time |
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PELCO® High Performance Silver PasteSilver flakes in an inorganic silicate aqueous solution, specially formulated adhesive for demanding bonding applications such as:
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| The excellent thermal and electrical conductivity, coupled with the absence of hydrocarbons, makes this product ideal for demanding specimen preparation in FESEM, XPS, ESCA, SIMS, Auger and other applications. PELCO® High Performance Silver Paste provides both high and thermal conductivity with a silver particle size of 20µm. Silver content >60% by weight. Cures at room temperature, but requires a 2 hour cure at 93°C (200°F) to achieve high conductivity and strong bond. Must be fully cured before using this product at cryogenic temperatures. Soluble in water to 260°C (500°F). Above this temperature it becomes almost insoluble. For nonconductive, high temperature adhesive try Product #16026. 16047 Technical Note (PDF 1.62MB) MSDS (PDF 102KB) Conductive Adhesives Comparison Table |
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PELCO® High Temperature Carbon PasteCarbon flakes in an inorganic silicate solution for bonding resisting up to 2000ºC. The PELCO® High Temperature Carbon Paste is aimed for applications where a conductive cement is needed which withstand temperatures up to 2000°C (3632°F).This paste is ideally suited for mounting specimens on hot stages for SEM , FESEM, XPS, ESCA, SIMS and AUGER systems. Also for applications where silver migration or a reaction with silver or nickel flakes could be a problem, this product would be an excellent alternative. Carbon content is 50-60% by weight in an inorganic silicate aqueous solution. Conductivity in cured state is 4.6 ohm/square/mil. Must be fully cured to achieve good conductivity and strong bond. Soluble in water to 260°C (500°F). Cure schedule is: air dry at room temperature for 2-4 hours, step cure at 93°C (200°F) and final cure at 260°C (500°F).Technical Notes, PELCO® High Temperature Carbon Paste (104KB pdf) |
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PELCO® High Performance Nickel PasteNickel flakes in an inorganic silicate aqueous solution providing a conductive adhesive for bonding applications such as:
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| The good thermal and electrical conductivity of this adhesive, coupled with the absence of hydrocarbons, makes this product suitable for demanding specimen preparation in surface science and SEM applications. Nickel particle size is 20µm, nickel content is >60%. The PELCO® High Performance Nickel Paste needs to be cured for 2 hours at 93°C (200°F) to achieve final electrical and mechanical properties. It is soluble in water to 260°C (500°F), above this temperature it becomes almost insoluble. For nonconductive, high temperature adhesive try Product #16026. PELCO® High Performance Nickel Paste, 16059, 16059-10 Technical Note (360KB pdf) |
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Graphite AerosolForms a thin, uniform conductive surface when sprayed on the sample. Dries very quickly; can be used for low magnification imaging of non-conductive samples. Excellent adhesion to most plastics, glass and metals. Other applications are for use as a lubricant (use dry in vacuum systems) and for plating non-conductors. 10 oz. (283.5g) |
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Leit C Plast™carbon base, good conductivity, large specimens |
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Heavy specimens may also be prepared for viewing in a SEM using Tempfix™ (or the Glue Gun -
see details in our non-conductive section) and LEIT-C-Plast™. First the specimen is fixed into place
with Tempfix™ or the Glue Gun. Afterward, an electrically conductive bridge is made between specimen
mount and specimen using LEIT-C-Plast™. It is not required to wait for drying because neither adhesive outgasses.
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EPO-TEK® Conductive Silver-EpoxyTwo Types:H-22 Epo-Tek® - silver resin paste / liquid hardener: (100:4.5 ratio) H20E Epo-Tek® - silver resin paste / silver resin paste hardener: (1:1 ratio) General Properties |
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Excellent handling characteristics, extremely long pot life at room temperature for this electrically conductive silver adhesive. High speed epoxy chip bonding systems are suitable for very fast cures, such as fast circuit repairs. Can be screen printed, machine dispersed or stamped and can withstand wire bonding temperatures in the range of 300 - 400°C.
Silver Conductive Epoxy, H-22 Epo-Tek®Two component, silver-filled epoxy system, consisting of a silver resin paste and a liquid hardener
(100:4.5). It is a free flowing paste, 100% solids system characterized by outstanding high temperature
properties as well as excellent solvent, chemical and moisture resistance. It has a long pot life and is
fast curing at relatively low temperatures. Containing no solvents or thinners; it will not outgas. It
can be applied by brush, spatula or hypodermic needle. H-22 can be useful for small angle cleavage in
material science and semi-conductor applications. Properties:
Technical Notes, H-22 Epo-Tek® Silver Conductive Epoxy (PDF/79KB) |
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Silver Conductive Epoxy, H2OE Epo-Tek®Two component, silver filled, epoxy system consisting of a silver resin paste and a silver resin hardener (1:1). It is a smooth, thixotropic paste, 100% solids system characterized by outstanding high temperature properties and excellent solvent, chemical and moisture resistance. It has a long pot life and is fast curing at relatively low temperatures. |
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| Will withstand 200°C for 1,000 hours. Containing no solvents or thinners, it will not outgas. H20E is ideal for electronic applications. Cures rapidly. Easy to use; the pure silver powder is dispersed in both the resin and the hardener so that it can be used in a convenient 1:1 mixing ratio. Non-toxic – complies with USP Class VI Biocompatibility standards. NASA approved. |
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| Cure Schedule (minimum bond temperature/time) 175°C ........45 seconds 150°C ..........5 minutes 120°C ........15 minutes 80°C.........90 minutes Properties: • Color: bright silver
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Silver Conductive Epoxy
Strong, highly conductive solderless connections and repairs.
Circuit boards. Static discharge shielding and grounding. Cure Schedule (Minimum bond temperature/time) Properties:
Service temperature range -91°C to 100°C (-132°F to 212°F) permanent bond. 0.4 ohms/sq/mil (25µm) Technical Notes (PDF/40KB) |
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Circuit Repairwith handy Silver Conductive PensDraws highly conductive silver traces, jumpers and shielding with high precision.
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Fast Drying Silver PaintThis very fine flake silver is suspended in iso-butyl methyl ketone (4-methylpentan-2-one) and forms a thin, smooth, highly conductive silver film which is both adherent and flexible. 30g. Fast drying silver suspension has been specifically designed to give increased coverage while maintaining a very high conductivity.
PELCO® Technical Notes, Fast Drying Silver Suspension (PDF/355KB) |
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Conducting Ink PenLeaves a mark which can be read in the electron beam in the SEM; can be used for marking or identifying objects. The mark is a high-resistance carbon conductive coating that would remove charge. |
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Fine Silver PowderHigh purity, high density fine silver powder for making conductive adhesives or embedding materials. Can be mixed with epoxies (# 14420 or #14443, below) for making conductive embedding material or with cyano acrylate gel (#14478, above) for a super fast drying, conductive adhesive to mount specimens. 99.99+% purity, particles size 7-15µm. |
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Hazard Warning Guides Used in the Following Listings
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