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XP Precision Sectioning Saw
and Diamond Sectioning / Wafering Blades

xp precision sectioning saw

Manual, precision sectioning saw designed for cutting printed circuit boards, ceramics, metal samples and composite components. Can also be used as a precision cut-off saw for small rods, wires, bars and tubes. Large working area of 6x10" with coolant bath below. The saw housing and table are made of non-corroding sturdy cross linked polyethylene to ensure durability. Powerful 1/4 HP (115V/1.75A/200W) motor with approximate variable speed of 400-3250 rpm, allows for selecting the best cutting speed for a variety of sample materials. Uses 4 and 5" diamond wafering blades with 5/8" (16mm) arbor holes.
Includes a 4" diamond wafering blade with medium/coarse grit in high concentration (#812-316-5), dressing stick and water soluble coolant.

Maximum cutting width: 3-1/2"
Maximum cutting depth: 4" blade = 1"; 5" blade = 1-1/2"

No 230V version is available; use #54585, 500W Step Down Transformer with 230V power outlets.

Made in USA

Prod # Description Unit Price Order / Quote
812-300 XP Precision Sectioning Saw, 115V, each each $975.00
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Diamond Sectioning / Wafering Blades
Diamond Sectioning / Wafering Blades

Diamond Sectioning / Wafering Blades

Can be used on all popular precision sectioning and cutting saws from PELCO, Buehler, LECO, Struers, Allied and many others.

These competitively priced Smart Cut™ precision diamond wafering blades are designed to provide superior smooth surface quality, low-distortion sectioning and enhanced blade life. The man-made diamond crystals in the Smart Cut™ diamond sectioning blades / wafering blades are oriented in such a way that diamonds are only activated at the exposed layer. As the exposed layer begins to wear out, diamonds in a new layer are activated, keeping up the cutting rate.

The advantages are:

  • Faster cutting action – leaves smooth finish
  • Less glazing – requires minimal dressing
  • More universal – compatible with a greater variety of materials

All Smart Cut™ diamond blades have a metal bonded diamond height of 4mm and are available in 3, 4, 5 & 6" diameter with the industry standard 1/2" or 5/8" arbor holes. Three grades are offered to fit most applications:

  • LC200MF medium/fine grit – low concentration for hard and tough materials, hard coating, hard ceramics and concrete ( equivalent to Buehler 15LC)
  • HC150MC medium/coarse grit - high concentration for composite materials, PCB, soft metals and bone (equivalent to Buehler 15HC)
  • HC320F fine grit – high concentration for glass fiber and carbon composites, soft ceramics and optical materials (equivalent to Buehler 5LC and 10LC)

Prod # Description Unit Price Order / Quote
1/2" Arbor Hole for Buehler, Struers, Allied and many others
812-310 Diamond Wafering Blade, 3" x 0.010" x 1/2" hole, medium/fine grit - low concentration each $183.50
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812-311 Diamond Wafering Blade, 3" x 0.010" x 1/2" hole, medium/coarse grit - high concentration each 208.50
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812-312 Diamond Wafering Blade, 3" x 0.010" x 1/2" hole, fine grit - high concentration each 183.50
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812-315 Diamond Wafering Blade, 4" x 0.012" x 1/2" hole, medium/fine grit - low concentration each 256.85
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812-316 Diamond Wafering Blade, 4" x 0.012" x 1/2" hole, medium/coarse grit - high concentration each 256.85
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812-317 Diamond Wafering Blade, 4" x 0.012" x 1/2" hole, fine grit - high concentration each 256.85
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812-320 Diamond Wafering Blade, 5" x 0.015" x 1/2" hole, medium/fine grit - low concentration each 209.50
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812-321 Diamond Wafering Blade, 5" x 0.015" x 1/2" hole, medium/coarse grit - high concentration each 209.50
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812-324 Diamond Wafering Blade, 5" x 0.015" x 1/2" hole, fine grit - high concentration each 209.50
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812-325 Diamond Wafering Blade, 6" x 0.020" x 1/2" hole, medium/fine grit - low concentration each 220.85
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812-326 Diamond Wafering Blade, 6" x 0.020" x 1/2" hole, medium/coarse grit - high concentration each 220.85
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812-327 Diamond Wafering Blade, 6" x 0.020" x 1/2" hole, fine grit - high concentration each 220.85
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5/8" Arbor Hole for PELCO® XP-300, PELCO® CS600A and PCS-400
812-315-5 Diamond Wafering Blade, 4" x 0.012" x 5/8" hole, medium/fine grit - low concentration each 225.00
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812-316-5 Diamond Wafering Blade, 4" x 0.012" x 5/8" hole, medium/coarse grit - high concentration each 209.00
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812-317-5 Diamond Wafering Blade, 4" x 0.012" x 5/8" hole, fine grit - high concentration each 209.00
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Cutting Fluids and Dressing Stick

The cutting fluids will assist in cooling the sample and disc during cutting operation. The cutting fluids will also remove cutting debris and reduce friction between cutting blade and sample.

Smart Cut Synthetic Water Soluble Cutting Fluid

Smart Cut Synthetic Water Soluble Cutting Fluid

The Smart Cut synthetic water soluble cutting fluid can be diluted 1:20 with water for cutting applications. Formulation is non-irritable, bio-resistant, easy to mix with water, and includes corrosion inhibitors. SDS 120KB PDF

Prod # Description Unit Price Order / Quote
812-648 Smart Cut Cutting Fluid, water soluble concentrate 1 quart $58.00
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812-649 Smart Cut Cutting Fluid, water soluble concentrate 1 gallon 134.00
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SO Type Cutting Fluid, Soluble Oil

SO Type Cutting Fluid, Soluble Oil

The SO type water soluble oil cutting fluid can be diluted 1:40 with water for cutting applications. Anti-corrosive, bio-resistant formulation. Available in 1 quart and 1 gallon container.
MSDS 89KB PDF

Prod # Description Unit Price Order / Quote
812-650 SO Cutting Fluid, Soluble Oil Concentrate 1 quart $28.50
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812-653 SO Cutting Fluid, Soluble Oil Concentrate 1 gallon 85.00
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Dressing Stick

Dressing Stick

The dressing stick is used to expose the cutting diamonds, to improve cutting rate and to reduce heating at the cutting edge. Especially useful when cutting softer material where the cut material tends to "clog up" the cutting edge of the blade. Size is 12.5 x 12.5 x 152mm (0.49" x 0.49" x 5.98").

Prod # Description Unit Price Order / Quote
812-420 Dressing Sticks for Diamond Blades each $16.20
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